Several effects in the laser welding process in Figure 2-1 deep penetration holes schematic 43 laser drilling of 3.1 Laser Drilling principle: the basic structure of the laser drilling machines including laser processing head, cooling systems, CNC equipment and operating The face plate (Figure 3-1). Figure 3-1 Schematic of the laser drilling machine 3.2 laser drilling process parameters * effects: pulse width of the pulse width of perforated punch depth, pore size, pore shape. Narrow pulse can be deeper and larger holes; wide pulse not only makes the hole depth, pore size, and hole surface roughness, dimensional accuracy decreased. The laser beam of remote control china laser pointer is very stable.
Defocus amount of drilling when the laser focus on the material surface in the laser drilling, the hole played deep, smaller taper. The focus is in a position under the surface under the same conditions, the deepest hole; and play too much into focus and defocus will make the laser power density is greatly reduced, and even labeled as a blind hole (Figure 3-2). Figure 3-2 defocus amount punch quality laser cutting principle and characteristics of 4.1 Laser cutting cutting laser beam focused into a small spot (minimum diameter of less than 0.1mm) to reach the focus point high power density (more than 106W/cm2). Structure shown in Figure 4-1 for the laser cutting head, in addition to the lens outside, it also has a coaxial nozzle emitting the auxiliary gas flow. More bottle shape china laser pointer will be manufactured.
Figure 4-1 Schematic diagram of the laser cutting head of 4.2 Laser Cutting classification and its mechanism. Vaporization: the workpiece in the laser under rapid heating to the boiling point, part of the material turned into steam Yat go, and part of the material for the ejecta from the cutting seam at the bottom of blown away. The cutting mechanism of the required laser power density is 108W / cm2, about, is the molten material cutting ※ melting cutting: laser workpiece is heated to molten state beam coaxial argon, helium, nitrogen auxiliary gas flow of molten material from the cut cracks blow. Melting cutting the required laser power density generally about 107W/cm2. Melting cutting oxygen to help: metal laser rapid heating to ignite more severe oxidation reaction (combustion) emit a lot of heat and oxygen, but also heats the next layer of metal, metal continued oxidation, and with the gas pressure to oxide from shear cracks blow. However, as a kind of new rising technology, cost of remote control china laser pointer is considerably higher than other products.
Laser cutting process parameters and their laws ※ laser power: laser cutting, the size of the required power is determined by the material properties and cutting mechanism. * Cutting speed: under the conditions of a certain power, the greater the plate thickness, the smaller the cutting speed. The cutting speed also have a greater impact on the incision surface roughness. ※ beam quality, focal length lens and the defocus amount: the laser output beam mode for the fundamental transverse mode of the laser cutting is the most favorable. The spot size is proportional to the focal length of the focusing lens. Short focal length lens can be smaller spot, but the depth of focus is very small. Defocus amount must remain the same cutting speed and cutting depth greater impact, cutting process, the general choice of negative defocus amount, the focus position on the cutting board surface below a certain point. Principles of remote control china laser pointer will be introduced at first.
Nozzle: The nozzle is the laser cutting quality and efficiency - an important component. Laser cutting is commonly used coaxial (air and the optical axis concentric) nozzle, the nozzle exit diameter should be selected in accordance with plate thickness. In addition, the distance of the nozzle to the workpiece surface cut quality also have a greater impact in order to ensure the cutting process is stable, this distance must remain unchanged. The semiconductor laser optical fiber communication requirements of the semiconductor laser light source: semiconductor laser is a laser in a large family. Compared with the solid-state lasers, gas lasers, and other types of lasers, it has a small size, light weight, high electro-optical conversion efficiency can be directly modulated, ease of use, so it is ideal for fiber optic communication among. Remote control green laser pointer is composed of a RF remote control.
No comments:
Post a Comment